¡¡¡¡To solve the pressure-sensitive mine-chip low-cost epoxy resin casting, I specifically purchased the company in Tianjin Jinqiao Insulation Materials Co., Ltd. tens of kilograms TXH-1156 epoxy potting material, will be my company in 2006 in the first half of approved sub-products remaining extract a few pieces of each sample to 10 the number of films of epoxy potting test results the following table: (left sample has been due to the long putting-damp, encapsulation is not carried out before the drying processing)
|
Chip Lot |
Potting ago Parameters |
Casting process |
5 days curing parameters |
15 days curing parameters |
Notes |
|
U 1mA |
I L (¦ÌA) |
U 1mA |
I L (¦ÌA) |
U 1mA |
I L (¦ÌA) |
|
0601-1 |
615V |
8.3 |
120ml gel +30 ml curing agent (volume ratio 4:1, weight ratio 100:10), and mix thoroughly 8min, room temperature curing. |
616V |
7.3 |
617 |
6.2 |
|
|
608V |
11.4 |
611V |
9.5 |
610 |
9.1 |
|
632V |
6.4 |
626V |
5.8 |
625 |
5.0 |
|
637V |
7.4 |
638V |
6.5 |
639 |
6.0 |
|
0603-3 |
702V |
10.5 |
703V |
9.3 |
705 |
8.4 |
|
|
705V |
18.1 |
712V |
14.0 |
709 |
12.6 |
|
716V |
18.7 |
722V |
17.6 |
720 |
15.5 |
|
705V |
13.3 |
708V |
8.4 |
707 |
7.8 |
|
725V |
16.9 |
729V |
15.1 |
728 |
13.6 |
|
0604-1 |
705V |
12.4 |
704V |
10.1 |
706 |
9.4 |
|
|
693V |
8.6 |
692V |
6.4 |
695 |
6.5 |
|
716V |
18.7 |
713V |
15.2 |
716 |
13.3 |
|
0604-5 |
673V |
7.5 |
673V |
6.7 6.7 |
674 674 |
6.3 |
|
|
676V |
13.5 |
677V |
11.3 |
677 |
10.8 |
|
669V |
7.2 |
670V |
6.1 |
671 |
5.8 |
|
660V |
10.6 |
661V |
8.8 |
664 |
8.8 |
|
666V |
9.7 |
667V |
7.1 |
667 |
6.7 |
|
0605-A2 |
664V |
6.2 |
200ml gel +40 ml curing agent (volume ratio 5:1, weight ratio of 100:8), and mix thoroughly 10min, room temperature curing. |
656V |
4.5 |
659 |
3.6 |
|
|
670V |
16.5 |
667V |
5.7 |
668 |
5.4 |
|
657V |
13.0 |
653V |
5.1 |
647 |
5.1 |
|
663V |
8.0 |
660V |
5.1 |
659 |
5.0. |
|
663V |
8.6 |
663V |
5.8 |
654 |
5.8 |
|
652V |
8.8 |
652V |
5.6 |
663 |
5.4 |
|
666V |
5.1 |
660V |
5.0 |
653 |
5.0 |
¡¡¡¡The results can be seen from the above: As long as the proportion of appropriate technology is correct, can be used to reduce the user-made epoxy resin casting cost (the other properties of rubber user-authentication). My company filling plastic processes are as follows:
¡¡¡¡Before the first chip encapsulation under 120 ¡æ drying 30 to 60 minutes; rubber, curing agent in accordance with 5:1 volume ratio (100g: 8g = 8ml weight ratio) with a good mix thoroughly, and mix thoroughly how to adjust the amount of time under the gum, but it should be ensure the full mix well; and then proceed to filling glue. Kaifeng, a longer time if the glue should be heated to glue 80 ~ 100 ¡æ, thermal insulation of about 30min in order to drive out moisture, cooling and curing agent and then allocated in proportion to the use of a good mix thoroughly. Potting after basic curing the product placed in the oven for 85 ~ 100 ¡æ heat insulation 30 ~ 60 minutes.
¡¡¡¡Use of other adhesive is also important to note that the user reduce the ratio of curing agent is generally from the manufacturers recommended ratio of 1 / 2 or so begin to try and curing agent dosage should not exceed manufacturer¡¯s recommended maximum ratio of 2 / 3. |
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